- Trust in D&X for your semiconductor materials.
- We tailor semiconductor materials according to our customers’ requests and deliver them immediately.High quality&Quick delivery
- In order to expand our business, we are constantly seeking new members to join our team.< Sales > < Office Management> < Product Management >
Thank you for visiting our company website!
Since our founding in 2008, our company has specialized in trading materials for the semiconductor industry concentrating on the concepts of “gratefulness” and “growth”, and have been welcomed enthusiastically by the semiconductor industry. Thanks to the sincere efforts of all the employees here at D&X, we have been able to meet the various requests of our customers and share the excitement of our business partners, which has kept the business strong.
In order to meet the diverse needs of our customers and continue to be at the technological foreground of the semiconductor industry, our employees work together to make true our motto of “high quality, quick delivery”.
We look forward to your continued guidance, encouragement and support.
Company Profile
Company Name | D&X Co., Ltd. |
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Founded | 8th April 2008 |
President | Guobin Dong |
Initial Capital | 10 million JPY |
Address | 1-1-4 Nagaoka, Mizuho, Nishitama-gun, Tokyo 190-1232 |
Tel | 042-557-2227 |
Fax | 042-557-2228 |
Company Activity | Sale of Semiconductor Materials |
MAP
Access
(Shinjuku Station) - [Chuo Line] - (Tachikawa Station) - [Ome Line] - (Haijima Station)
- [Hachiko Line] - (Hakonegasaki Station) - 20min on foot
- [Ome Line] - (Hamura Station) - 40min on foot / 10min by Taxi
- [Ken-O Expressway] - (Ome Interchange) - 20min by car
Bare Si Wafer
Wafer Size | From 50 to 450 mm diameter |
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Wafer Grade | Prime Wafers (customizable surface roughness, resistivity, edge, thickness, etc.) Low Particle Wafers Test Wafers Monitor Wafers Reclaim Wafers Coinroll Wafers |
Available Brands | SEH, SUMCO, Global Wafers, Siltronic, SK Siltron, others |
Special Wafers | SOI, Epi, Glass, Quartz, Compound Wafers, etc. |
Other | Low haze, With/Without Lasermark (customizable code), Dopant, Orientation, Notch (Flat), Surface Condition, Metal Contamination, etc can all be customized according to the client’s request. |
Back Grinding Tape
Main Features |
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- Strong adhesion to prevent water damage - No adhesive residue keeps adherends clean - Especially flat to help with grinding - Can be used with uneven surfaces (bump wafers) |
Other properties |
- Reduced warping for ultra-thin grinding - Heat resistance during grinding/polishing - Can protect films for long periods and from heat - Antistatic properties when peeling - Chemical, acid and base resistance - Protective function for high bumps |
We offer two main types of tape: UV tapes which can be peeled without stress under UV radiation, and non-UV tapes designed to be peeled without UV radiation.
We can also change specifications and design new tapes especially for our customers upon request.
We also support trial production runs for small quantities. Please contact us to learn more.
Dicing Tape
Main Features |
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- High level of uniform expansion - Reduces chipping - Strong adhesive properties - Prevents whiskers - High heat resistance |
Other properties |
- Antistatic properties - High transparency - High elasticity |
We offer UV-type dicing tapes that can be easily peeled off by reducing the adhesive strength through UV irradiation while increasing pick-up properties during die bonding.
We can also change specifications and design new tapes especially for our customers upon request.
We also support trial production runs for small quantities. Please contact us to learn more.